PORON ThinStik Series Foam: Ultra-thin Device Gap Filling and Sealing Solutions
source: Foam Pageviews: time:Jun 27, 2024
describe:
PORON ThinStik Series Foam is a polyurethane foam material from Rogers Corporation. Compared with traditional laminated adhesive structures, this innovative material is more compressible. It not only perfectly fills gaps, but also provides excellent
PORON ThinStik Series Foam: Ultra-thin Device Gap Filling and Sealing Solutions
PORON ThinStik Series Foam is a
polyurethane foam material from Rogers Corporation. PORON foam material with excellent compressibility is integrated with a pressure-sensitive adhesive layer to provide an all-in-one solution for ultra-thin device gap filling and sealing design. Compared with traditional laminated adhesive structures, this innovative material is more compressible. It not only perfectly fills gaps, but also provides excellent sealing performance. It is also easy to die-cut and can meet the needs of various complex scenarios.
Rogers PORON ThinStik material combines PORON polyurethane foam material with a pressure-sensitive adhesive layer for applications up to 0.1mm thick.
Features
Ultra-thin and highly compressible
Provides long-term protection and sealing
Available in 5 products
PORON® ThinStik ShockSeal™ Foam Material: 79TS1-09021
PORON® ThinStik™ Foam Material: 92TS1-09020
PORON® ThinStik™ Foam Material: 92TS1-12020
PORON® ThinStik™ Soft Seal Foam Material: 15TS1-06021
PORON® ThinStik™ Soft Seal Foam Material: 15TS1-06030
Features and Benefits of PORON ThinStik Series Foam
1. Ultra-thin design: Provides powerful functionality with extremely thin thickness to meet the space requirements of ultra-thin devices.
2. High compression ratio: Able to maintain shape under compression, providing a long-lasting sealing effect.
3. Excellent resilience: Even after long-term compression, it can quickly return to its original shape.
4. Good chemical stability: Resistant to most chemicals, ensuring stability for long-term use.
5. Space saving: Ultra-thin thickness enables it to maximize its effectiveness in a limited space.
6. Durable: High compression ratio and excellent resilience ensure long-term use.
7. Diverse application scenarios: Suitable for various ultra-thin electronic devices, including mobile phones, tablets, laptops, etc.
8. Easy to process: The material is easy to cut and shape to meet customized needs.
9. Improve product performance: Improve the waterproof, dustproof and impact resistance of the equipment through effective sealing and shock absorption.
Application of PORON ThinStik series foam
1. Smartphones: Used for sealing the screen and body to improve the waterproof and dustproof level.
2. Tablets: Provide necessary support and protection in a thin body.
3. Laptops: Used for shock absorption of keyboards and screens, as well as sealing of edges.
4. Wearable devices: Provide comfortable fit and necessary protection in a compact space.
5. Medical equipment: Used for sealing precision instruments to ensure the stability of the equipment in various environments.
In order to meet the needs of our customers, Shenzhen Kaiming provides die-cutting services for various brands of foam materials and adhesive materials. Die-cutting includes precision stamping, die-cutting, adhesive, lamination, striping, rewinding, slitting, die-cutting, etc. We provide technical consultation on polyurethane foam materials and adhesive solutions for die-cutting. We provide customers with one-stop solutions from materials, die-cutting to adhesive, and provide customers with high-quality and cost-effective terminal products.